DOWSIL™ TC-5960 導熱化合物
DOWSIL™ TC-5960 Thermally Conductive Compound
hermal conductivity: 6.0 W/mK
Thermal resistance: 0.03 °C-cm2/W @ 16 µm gap
Excellent pump-out resistance for bare die application
High thixotropy – index of 9
One-part material – no cure required
Solvent-free formulation – offers material stability
Easy application – screen- and stencil-printable
DOWSIL™ TC-5960 thermally conductive compound is grease like material that is highly loaded with thermally conductive fillers in a silicone matrix. This combination promotes high thermal conductivity, low pump-out and high-temperature stability. The compound is designed to maintain a positive heat sink seal to improve heat transfer from an electrical device or PCB system assembly to a heat sink or chassis especially for consumer devices, there is also a continual trend towards smaller and more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compound plays an integral role here. Thermally conductive material acts as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). This material has properties such as low thermal resistance, high thermal conductivity, and thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device. Thermal compound has advantages over other Thermal Interface Materials (TIMs) due to anti pump-out, ease of application on to heat sinks (screen printing), and ease of re-work.
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