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TTC-MHR03

New spring clip design supports all standard SDRAM, DDR1 and DDR2

Minimum Order Quantity : Under 1000
Are samples available for this product? : Yes

Language : English

TTC-MHR03
 
Features


‧Reduces the temperature of the memory module and improves RAM performance
‧New spring clip design supports all standard SDRAM, DDR1 and DDR2

Specification

Outline Dimension
Weight
Thermal Pad
Packing
123 x 28.1 x 9.5 mm
63g
110 x 16 x 0.5 mm 2pcs
blister card

Packing

1CTN(PCS) 10.3
7
100
1.3
N.W.(KGS)
G.W.(KGS)
MEAS'T(CUFT)

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