Slim Design with Rich I/O Ports and Excellent Thermal Solution Meet Client Expectations
In order to fulfill the requirements for application in limited-space environment (such as digital signage, healthcare, surveillance, and power & energy industry) ,DFI dictates that all thin-sized boards must measure less than 25mm with I/O shield, but designed with a multitude of I/O ports. Based on the board space and height limitation, the majority of industrial boards are unable to support rich I/O ports. However, with the DFI qualified board’s lay-out capability, DFI’s thin boards can support three independent displays via HDMI, LVDS, VGA, DVI or DP, and simultaneously support up to 9 USB 3.0/2.0 ports, 4 COM ports, and rich expansion slots. Having that said, DFI is aiming to build a powerful thin board that can help users operate facilities in a more flexible way. Low maintenance and high level of robustness without vulnerable fans are becoming essential to pursuit year-long reliable usage. Under the high performance of CPU, our Thin Mini-ITX Motherboards come with new proprietary heat spreader technology to reduce the height of the board, and it also further support thin boards to be more flexible in a variety of applications, including low noise-level and narrow conditions. With brilliant Thermal solutions built right into Thin Mini-ITX Board, we successfully exclude superheated operating and fulfill diversity of needs.